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Add molding potting glue

Product Details:

Product Information:

Power potting sealant series

Main uses

Led power supply, outdoor power supply, transformers and other places heat dissipation, waterproof, moisture-proof products potting

Encapsulation of electronic and electrical components

Insulation, heat conduction, waterproof and moisture proof sealing for printed circuit board and automobile electric appliances

Other places that need to be sealed



Product Features

Comply with Rohs, HF, REACH and other environmental requirements

Excellent weather resistance, ozone resistance and chemical resistance.

No solvent, solid content up to 100% . No shrinkage, no exothermic curing

Wide Range of temperature resistance (- 50 °C ~ 200 °C) , high insulation strength


Technical parameter



Performance name


JD501A/B

JD535A/B

JD506A/B

Before curing


Appearance


Black, whiteOr Gray, sticky liquid


Black, white orGray, viscous liquid


Black, whiteOr Gray, sticky liquid


A Viscosity mpa.s


2000±500

6000±500

3000±500

B Viscosity mpa.s


2000±500

2000±500

3000±500

After mixing


Specific gravity (g/ml)


1.50±0.05

1.50±0.05

1.50±0.05

Specific gravity


1:1

1:1

1:1

Mixed viscosity (mpa.s)


2000±500

3000±500

3000±500

Operating Time


40-120

40-120

40-120

固化后

Hardness(shore A)


55±5

55±5

55±5

Breakdown voltage(KV/mm)


10

10

10

Breakdown voltage(Ω·cm)


1.0×1014

1.0×1014

1.0×1014

Volume resistivity(60HZ)


3.0

3.0

3.0

Thermal Conductivity(Wmk

0.6

0.6

0.6

Packing specification


10kg/barrel,20kg/barrel,25kg/barrel


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